HONG KONG HAOCHIP TRADING CO., LIMITED - IC Sockets - Sockets for ICs, Transistors | Page 3 | Genuine Components, Fast Shipping

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
243-32-1-06 CONN IC DIP SOCKET 32POS TIN CNC Tech	1,109	0.49	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
232-32-TR CONN SOCKET PLCC 32POS TIN CNC Tech	4,228	0.84	RFQ	Datasheet	-	Tape & Reel (TR)	Active	PLCC	32 (4 x 8)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
210-1-14-003 CONN IC DIP SOCKET 14POS GOLD CNC Tech	532	0.94	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
210-1-16-003 CONN IC DIP SOCKET 16POS GOLD CNC Tech	298	1.03	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
232-44-TR CONN SOCKET PLCC 44POS TIN CNC Tech	392	1.15	RFQ	Datasheet	-	Tape & Reel (TR)	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
210-1-20-003 CONN IC DIP SOCKET 20POS GOLD CNC Tech	690	1.22	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
210-1-28-006 CONN IC DIP SOCKET 28POS GOLD CNC Tech	1,264	1.68	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
211-1-06-003 CONN IC DIP SOCKET 6POS GOLD CNC Tech	7,352	0.57	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C
211-1-08-003 CONN IC DIP SOCKET 8POS GOLD CNC Tech	5,172	0.63	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C
211-1-14-003 CONN IC DIP SOCKET 14POS GOLD CNC Tech	2,465	0.78	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C

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