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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    114-41-422-41-117000

    114-41-422-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,766 2.72
    RFQ
    		114-41-422-41-117000

    Datasheet

         		114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-322-41-117000

    114-91-322-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,866 2.72
    RFQ
    		114-91-322-41-117000

    Datasheet

         		114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-422-41-117000

    114-91-422-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,030 2.72
    RFQ
    		114-91-422-41-117000

    Datasheet

         		114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-99-640-41-001000

    210-99-640-41-001000

    CONN IC DIP SOCKET 40POS TINLEAD

    Mill-Max Manufacturing Corp.

    		 3,556 2.71
    RFQ
    		210-99-640-41-001000

    Datasheet

         		210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-44-640-41-001000

    210-44-640-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 1,688 2.71
    RFQ
    		210-44-640-41-001000

    Datasheet

         		210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-652-41-004101

    116-83-652-41-004101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    		 4,772 1.97
    RFQ
    		116-83-652-41-004101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    317-43-111-41-005000

    317-43-111-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    		 1,796 2.80
    RFQ
    		317-43-111-41-005000

    Datasheet

         		317 Bulk Active SIP 11 (1 x 11) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-636-41-001000

    110-47-636-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    		 1,667 2.71
    RFQ
    		110-47-636-41-001000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-310-41-001000

    612-41-310-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 1,948 2.34
    RFQ
    		612-41-310-41-001000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-310-41-001000

    612-91-310-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,739 2.34
    RFQ
    		612-91-310-41-001000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-422-41-003000

    115-47-422-41-003000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,849 2.72
    RFQ
    		115-47-422-41-003000

    Datasheet

         		115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-308-41-001000

    612-41-308-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,030 2.71
    RFQ
    		612-41-308-41-001000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-308-41-001000

    612-91-308-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,606 2.71
    RFQ
    		612-91-308-41-001000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-210-41-005000

    917-41-210-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    		 2,937 2.71
    RFQ
    		917-41-210-41-005000

    Datasheet

         		917 Tube Active Transistor, TO-100 10 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-91-210-41-005000

    917-91-210-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    		 1,869 2.71
    RFQ
    		917-91-210-41-005000

    Datasheet

         		917 Tube Active Transistor, TO-100 10 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-222-31-018000

    714-43-222-31-018000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,533 1.37
    RFQ
    		714-43-222-31-018000

    Datasheet

         		714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0608-G-H

    APH-0608-G-H

    APH-0608-G-H

    Samtec Inc.

    		 3,059 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0208-G-H

    APH-0208-G-H

    APH-0208-G-H

    Samtec Inc.

    		 3,699 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1708-G-H

    APH-1708-G-H

    APH-1708-G-H

    Samtec Inc.

    		 4,316 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0808-G-H

    APH-0808-G-H

    APH-0808-G-H

    Samtec Inc.

    		 1,483 -
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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