HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    612-41-306-41-003000

    612-41-306-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,427 2.66
    RFQ
    612-41-306-41-003000

    Datasheet

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-306-41-003000

    612-91-306-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    1,915 2.66
    RFQ
    612-91-306-41-003000

    Datasheet

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-640-T-C

    APA-640-T-C

    ADAPTER PLUG

    Samtec Inc.

    1,294 2.37
    RFQ
    APA-640-T-C

    Datasheet

    APA Bulk Active - 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-640-T-C

    APO-640-T-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,728 -
    RFQ
    APO-640-T-C

    Datasheet

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    30-6511-11

    30-6511-11

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    1,757 3.23
    RFQ
    30-6511-11

    Datasheet

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    11-0511-11

    11-0511-11

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    4,600 3.23
    RFQ
    11-0511-11

    Datasheet

    511 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    19-0501-21

    19-0501-21

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    4,732 3.23
    RFQ
    19-0501-21

    Datasheet

    501 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-6621-30

    16-6621-30

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    4,859 3.23
    RFQ
    16-6621-30

    Datasheet

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    115-47-324-41-003000

    115-47-324-41-003000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    1,099 2.64
    RFQ
    115-47-324-41-003000

    Datasheet

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-624-41-003000

    115-47-624-41-003000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    1,921 2.64
    RFQ
    115-47-624-41-003000

    Datasheet

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0215-T-15

    HLS-0215-T-15

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,306 -
    RFQ
    HLS-0215-T-15

    Datasheet

    HLS Tube Active SIP 30 (2 x 15) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    111-41-316-41-001000

    111-41-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,769 2.61
    RFQ
    111-41-316-41-001000

    Datasheet

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-316-41-001000

    111-91-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,927 2.61
    RFQ
    111-91-316-41-001000

    Datasheet

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-41-320-41-001000

    111-41-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,329 2.65
    RFQ
    111-41-320-41-001000

    Datasheet

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-41-420-41-001000

    111-41-420-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,862 2.65
    RFQ
    111-41-420-41-001000

    Datasheet

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-320-41-001000

    111-91-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,325 2.65
    RFQ
    111-91-320-41-001000

    Datasheet

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-420-41-001000

    111-91-420-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,041 2.65
    RFQ
    111-91-420-41-001000

    Datasheet

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-632-G-J

    APO-632-G-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,230 -
    RFQ
    APO-632-G-J

    Datasheet

    APO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    510-83-225-17-001101

    510-83-225-17-001101

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    2,027 2.09
    RFQ
    510-83-225-17-001101

    Datasheet

    510 Bulk Active PGA 225 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-225-17-061101

    510-83-225-17-061101

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    3,444 2.09
    RFQ
    510-83-225-17-061101

    Datasheet

    510 Bulk Active PGA 225 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 489490491492493494495496...955Next»
    Search

    Search

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER