HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    614-83-069-11-061112

    614-83-069-11-061112

    CONN SOCKET PGA 69POS GOLD

    Preci-Dip

    3,054 1.79
    RFQ
    614-83-069-11-061112

    Datasheet

    614 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-93-306-41-013000

    146-93-306-41-013000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    1,762 2.46
    RFQ
    146-93-306-41-013000

    Datasheet

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-43-306-41-013000

    146-43-306-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    2,650 2.46
    RFQ
    146-43-306-41-013000

    Datasheet

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-640-ZSGT-L

    ICA-640-ZSGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,962 -
    RFQ
    ICA-640-ZSGT-L

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    104-11-306-41-770000

    104-11-306-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,863 2.46
    RFQ
    104-11-306-41-770000

    Datasheet

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-41-210-41-117000

    114-41-210-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,428 2.37
    RFQ
    114-41-210-41-117000

    Datasheet

    114 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-210-41-117000

    114-91-210-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,552 2.37
    RFQ
    114-91-210-41-117000

    Datasheet

    114 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-624-T-T

    APO-624-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,476 -
    RFQ
    APO-624-T-T

    Datasheet

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-310-G-A1

    APO-310-G-A1

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,725 -
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    114-41-308-41-117000

    114-41-308-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,199 2.42
    RFQ
    114-41-308-41-117000

    Datasheet

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-308-41-117000

    114-91-308-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,818 2.42
    RFQ
    114-91-308-41-117000

    Datasheet

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    11-0501-21

    11-0501-21

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    1,493 2.22
    RFQ
    11-0501-21

    Datasheet

    501 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    11-0501-31

    11-0501-31

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    3,011 2.22
    RFQ
    11-0501-31

    Datasheet

    501 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-516-11

    24-516-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    1,578 2.74
    RFQ
    24-516-11

    Datasheet

    516 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-43-304-61-003000

    116-43-304-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,858 2.44
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-304-61-003000

    116-93-304-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,556 2.44
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-310-41-006000

    116-47-310-41-006000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    3,206 2.39
    RFQ
    116-47-310-41-006000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-91-105-41-005000

    317-91-105-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    4,365 2.54
    RFQ
    317-91-105-41-005000

    Datasheet

    317 Bulk Active SIP 5 (1 x 5) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-632-SM-O

    ICF-632-SM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,204 -
    RFQ
    ICF-632-SM-O

    Datasheet

    ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    26-823-90C

    26-823-90C

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    1,927 2.97
    RFQ
    26-823-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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