HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    20-7810-10

    20-7810-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    4,085 2.84
    RFQ
    20-7810-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7820-10

    20-7820-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    1,498 2.84
    RFQ
    20-7820-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7825-10

    20-7825-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    2,234 2.84
    RFQ
    20-7825-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7850-10

    20-7850-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    1,675 2.84
    RFQ
    20-7850-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7875-10

    20-7875-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    4,675 2.84
    RFQ
    20-7875-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7903-10

    20-7903-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    1,350 2.84
    RFQ
    20-7903-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7905-10

    20-7905-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    3,726 2.84
    RFQ
    20-7905-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7906-10

    20-7906-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    1,582 2.84
    RFQ
    20-7906-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    317-91-102-41-005000

    317-91-102-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    3,732 2.44
    RFQ
    317-91-102-41-005000

    Datasheet

    317 Bulk Active SIP 2 (1 x 2) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-41-306-41-117000

    114-41-306-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,915 2.38
    RFQ
    114-41-306-41-117000

    Datasheet

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-306-41-117000

    114-91-306-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,377 2.38
    RFQ
    114-91-306-41-117000

    Datasheet

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    17-71140-10

    17-71140-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    2,140 2.84
    RFQ
    17-71140-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-71250-10

    17-71250-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    4,573 2.84
    RFQ
    17-71250-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-7465-10

    17-7465-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    3,443 2.84
    RFQ
    17-7465-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-7490-10

    17-7490-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    2,497 2.84
    RFQ
    17-7490-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-7500-10

    17-7500-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    1,155 2.84
    RFQ
    17-7500-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-7650-10

    17-7650-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    1,287 2.84
    RFQ
    17-7650-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-7750-10

    17-7750-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    1,970 2.84
    RFQ
    17-7750-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-810-90WR

    16-810-90WR

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,989 2.84
    RFQ
    16-810-90WR

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    115-43-304-61-001000

    115-43-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,036 2.34
    RFQ

    -

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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