HONG KONG HAOCHIP TRADING CO., LIMITED86+15817455051 HONG KONG HAOCHIP TRADING CO., LIMITEDKyle@hkhaochip.com
HONG KONG HAOCHIP TRADING CO., LIMITEDUpload BOM
    HONG KONG HAOCHIP TRADING CO., LIMITED
    All Categories
    English 简体中文 Русский 日本語 한국어 Spanish
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    42-6513-11H

    42-6513-11H

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    		 3,580 2.55
    RFQ
    		42-6513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-820-90

    20-820-90

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 2,846 2.55
    RFQ
    		20-820-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    20-820-90TWR

    20-820-90TWR

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    		 2,489 2.55
    RFQ
    		20-820-90TWR

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    20-822-90

    20-822-90

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 2,909 2.55
    RFQ
    		20-822-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    24-6823-90T

    24-6823-90T

    CONN IC DIP SOCKET 24POS TIN

    Aries Electronics

    		 2,076 2.55
    RFQ
    		24-6823-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    20-810-90T

    20-810-90T

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    		 4,656 2.55
    RFQ
    		20-810-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    22-4820-90C

    22-4820-90C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 4,050 2.55
    RFQ
    		22-4820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-6822-90C

    22-6822-90C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 1,283 2.55
    RFQ
    		22-6822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-6823-90C

    22-6823-90C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 1,264 2.55
    RFQ
    		22-6823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    714-43-216-31-018000

    714-43-216-31-018000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,473 1.04
    RFQ
    		714-43-216-31-018000

    Datasheet

         		714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    16-6810-90T

    16-6810-90T

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    		 2,573 2.56
    RFQ
    		16-6810-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    16-6823-90

    16-6823-90

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 3,447 2.56
    RFQ
    		16-6823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    16-2822-90C

    16-2822-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 4,515 2.56
    RFQ
    		16-2822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-2823-90C

    16-2823-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 3,236 2.56
    RFQ
    		16-2823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-4820-90C

    16-4820-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 1,637 2.56
    RFQ
    		16-4820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-4822-90C

    16-4822-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 1,476 2.56
    RFQ
    		16-4822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-6820-90C

    16-6820-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 1,472 2.56
    RFQ
    		16-6820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-6822-90C

    16-6822-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 1,929 2.56
    RFQ
    		16-6822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-6823-90C

    16-6823-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 4,231 2.56
    RFQ
    		16-6823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-0508-20

    28-0508-20

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    		 2,370 2.56
    RFQ
    		28-0508-20

    Datasheet

         		508 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    Total 19086 Record«Prev1... 419420421422423424425426...955Next»
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Help you to save your cost and time.
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Reliable package for your goods.
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Fast reliable delivery to save time.
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Quality premium after-sale service.
    Search

    Search

     PRODUCT

    PRODUCT

     PHONE

    PHONE

     USER

    USER
    HONG KONG HAOCHIP TRADING CO., LIMITED
    HONG KONG HAOCHIP TRADING CO., LIMITED
    Kyle@hkhaochip.com