HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    18-0503-30

    18-0503-30

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    1,242 2.04
    RFQ
    18-0503-30

    Datasheet

    0503 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    16-3508-201

    16-3508-201

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,566 2.04
    RFQ
    16-3508-201

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-93-304-41-008000

    116-93-304-41-008000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    3,101 1.65
    RFQ
    116-93-304-41-008000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-304-41-008000

    116-43-304-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,810 1.65
    RFQ
    116-43-304-41-008000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0306-T-18

    HLS-0306-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,749 -
    RFQ
    HLS-0306-T-18

    Datasheet

    HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    614-43-640-31-012000

    614-43-640-31-012000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    3,312 1.65
    RFQ
    614-43-640-31-012000

    Datasheet

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-650-41-001101

    116-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,315 1.50
    RFQ
    116-83-650-41-001101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4-1437531-1

    4-1437531-1

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    1,638 -
    RFQ

    -

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
    ICF-322-SM-O

    ICF-322-SM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,247 -
    RFQ
    ICF-322-SM-O

    Datasheet

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-S-I

    ICF-322-S-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,320 -
    RFQ
    ICF-322-S-I

    Datasheet

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    510-83-132-13-002101

    510-83-132-13-002101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    4,860 1.22
    RFQ
    510-83-132-13-002101

    Datasheet

    510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-132-13-042101

    510-83-132-13-042101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    2,339 1.22
    RFQ
    510-83-132-13-042101

    Datasheet

    510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-320-T-P

    APA-320-T-P

    ADAPTER PLUG

    Samtec Inc.

    4,119 1.58
    RFQ
    APA-320-T-P

    Datasheet

    APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    18-3518-01

    18-3518-01

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,576 2.04
    RFQ
    18-3518-01

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-822-90

    16-822-90

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,524 2.04
    RFQ
    16-822-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    24-0517-90C

    24-0517-90C

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    4,891 2.04
    RFQ
    24-0517-90C

    Datasheet

    0517 Bulk Active SIP 24 (1 x 24) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-241-18-071101

    510-87-241-18-071101

    CONN SOCKET PGA 241POS GOLD

    Preci-Dip

    2,886 1.41
    RFQ
    510-87-241-18-071101

    Datasheet

    510 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-241-18-072101

    510-87-241-18-072101

    CONN SOCKET PGA 241POS GOLD

    Preci-Dip

    2,758 1.41
    RFQ
    510-87-241-18-072101

    Datasheet

    510 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-87-078-13-061117

    514-87-078-13-061117

    CONN SOCKET PGA 78POS GOLD

    Preci-Dip

    4,132 1.36
    RFQ
    514-87-078-13-061117

    Datasheet

    514 Bulk Active PGA 78 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-ZWGT-3

    ICA-624-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,387 -
    RFQ
    ICA-624-ZWGT-3

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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