HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    10-2501-21

    10-2501-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,434 1.57
    RFQ
    10-2501-21

    Datasheet

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-2501-31

    10-2501-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,993 1.57
    RFQ
    10-2501-31

    Datasheet

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-87-174-17-061101

    510-87-174-17-061101

    CONN SOCKET PGA 174POS GOLD

    Preci-Dip

    4,665 1.05
    RFQ
    510-87-174-17-061101

    Datasheet

    510 Bulk Active PGA 174 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-174-17-081101

    510-87-174-17-081101

    CONN SOCKET PGA 174POS GOLD

    Preci-Dip

    3,344 1.05
    RFQ
    510-87-174-17-081101

    Datasheet

    510 Bulk Active PGA 174 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-952-41-001101

    612-83-952-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    1,728 1.09
    RFQ
    612-83-952-41-001101

    Datasheet

    612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-ATT

    ICA-320-ATT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,606 -
    RFQ
    ICA-320-ATT

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    510-87-180-14-031101

    510-87-180-14-031101

    CONN SOCKET PGA 180POS GOLD

    Preci-Dip

    1,848 1.09
    RFQ
    510-87-180-14-031101

    Datasheet

    510 Bulk Active PGA 180 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0112-T-12

    HLS-0112-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,423 -
    RFQ
    HLS-0112-T-12

    Datasheet

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-99-304-41-001000

    110-99-304-41-001000

    CONN IC DIP SOCKET 4POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,570 1.30
    RFQ
    110-99-304-41-001000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-640-41-009101

    116-83-640-41-009101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    1,584 1.01
    RFQ
    116-83-640-41-009101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0211-T-22

    HLS-0211-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,209 -
    RFQ
    HLS-0211-T-22

    Datasheet

    HLS Tube Active SIP 22 (2 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICA-318-WGT

    ICA-318-WGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,294 -
    RFQ
    ICA-318-WGT

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-ZAGT

    ICA-318-ZAGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,842 -
    RFQ
    ICA-318-ZAGT

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-ZAGT

    ICO-318-ZAGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,331 -
    RFQ
    ICO-318-ZAGT

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    31-0518-00

    31-0518-00

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    2,128 1.58
    RFQ
    31-0518-00

    Datasheet

    518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    8060-1G13

    8060-1G13

    CONN TRANSIST TO-5 3POS GOLD

    TE Connectivity AMP Connectors

    4,650 -
    RFQ
    8060-1G13

    Datasheet

    8060 Bulk Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    40-6513-00

    40-6513-00

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,864 1.23
    RFQ
    40-6513-00

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6511-11

    08-6511-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,372 1.39
    RFQ
    08-6511-11

    Datasheet

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-83-642-41-008101

    116-83-642-41-008101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    1,268 1.02
    RFQ
    116-83-642-41-008101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-ZSGG

    ICO-314-ZSGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,226 -
    RFQ
    ICO-314-ZSGG

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 316317318319320321322323...955Next»
    Search

    Search

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER