Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
AR16-HZL/07-TTCONN IC DIP SOCKET 16POS GOLD Assmann WSW Components |
3,228 | - |
|
![]() Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
![]() |
AR 10-HZL/01-TTCONN IC DIP SOCKET 10POS TIN Assmann WSW Components |
3,310 | 0.22 |
|
![]() Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
![]() |
A-CCS20-ZCONN SOCKET PLCC 20POS TIN Assmann WSW Components |
4,968 | - |
|
![]() Datasheet |
- | Bag | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
![]() |
AR18-HZL/07-TTCONN IC DIP SOCKET 18POS GOLD Assmann WSW Components |
1,911 | - |
|
![]() Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
![]() |
AR14-HZL/01-TTCONN IC DIP SOCKET 14POS GOLD Assmann WSW Components |
1,652 | - |
|
![]() Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
![]() |
AW 127-10/Z-TSOCKET 10 CONTACTS SINGLE ROW Assmann WSW Components |
1,526 | 0.37 |
|
![]() Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
![]() |
A22-LCGCONN IC DIP SOCKET 22POS GOLD Assmann WSW Components |
3,943 | - |
|
![]() Datasheet |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | - | - | - |
![]() |
AW 127-21/Z-TSOCKET 21 CONTACTS SINGLE ROW Assmann WSW Components |
2,162 | 0.27 |
|
![]() Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
![]() |
A-CCS32-ZCONN SOCKET PLCC 32POS TIN Assmann WSW Components |
2,801 | - |
|
![]() Datasheet |
- | Bag | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
![]() |
A08-LCG-T-RCONN IC DIP SOCKET 8POS GOLD Assmann WSW Components |
1,955 | - |
|
![]() Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |