HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    22-0518-10H

    22-0518-10H

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    1,209 0.62
    RFQ
    22-0518-10H

    Datasheet

    518 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-1518-10H

    22-1518-10H

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    1,829 0.62
    RFQ
    22-1518-10H

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    07-0517-90C

    07-0517-90C

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    4,518 0.62
    RFQ
    07-0517-90C

    Datasheet

    0517 Bulk Active SIP 7 (1 x 7) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-3518-00

    16-3518-00

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,206 0.51
    RFQ
    16-3518-00

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-3518-11H

    06-3518-11H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,187 0.62
    RFQ
    06-3518-11H

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-6513-10T

    16-6513-10T

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    1,516 0.63
    RFQ
    16-6513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-1518-11

    18-1518-11

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,019 0.62
    RFQ
    18-1518-11

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-0518-10T

    24-0518-10T

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    2,547 0.62
    RFQ
    24-0518-10T

    Datasheet

    518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-1518-10T

    24-1518-10T

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,680 0.62
    RFQ
    24-1518-10T

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-6513-10T

    12-6513-10T

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    1,758 0.50
    RFQ
    12-6513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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