HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    02-0503-21

    02-0503-21

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,512 0.38
    RFQ
    02-0503-21

    Datasheet

    0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    02-0503-31

    02-0503-31

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,565 0.38
    RFQ
    02-0503-31

    Datasheet

    0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    06-0518-11H

    06-0518-11H

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    2,288 0.38
    RFQ
    06-0518-11H

    Datasheet

    518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-1518-11H

    06-1518-11H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,748 0.38
    RFQ
    06-1518-11H

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    13-0518-10H

    13-0518-10H

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    2,877 0.38
    RFQ
    13-0518-10H

    Datasheet

    518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-0518-10T

    14-0518-10T

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    2,140 0.38
    RFQ
    14-0518-10T

    Datasheet

    518 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-1518-10T

    14-1518-10T

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    1,070 0.38
    RFQ
    14-1518-10T

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-0513-10H

    08-0513-10H

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,020 0.40
    RFQ
    08-0513-10H

    Datasheet

    0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-1518-10

    16-1518-10

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,659 0.39
    RFQ
    16-1518-10

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-1518-11

    08-1518-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,234 0.30
    RFQ
    08-1518-11

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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