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IC Sockets
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
22-0503-31CONN SOCKET SIP 22POS GOLD Aries Electronics |
2,414 | 3.62 |
|
Datasheet |
0503 | Bulk | Active | SIP | 22 (1 x 22) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
|
|
16-3508-211CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
1,409 | 3.63 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
16-3508-311CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
2,805 | 3.63 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
36-3513-11HCONN IC DIP SOCKET 36POS GOLD Aries Electronics |
3,117 | 3.37 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
28-7440-10CONN SOCKET SIP 28POS TIN Aries Electronics |
3,660 | 3.63 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 28 (1 x 28) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
28-7770-10CONN SOCKET SIP 28POS TIN Aries Electronics |
3,949 | 3.63 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 28 (1 x 28) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
28-7850-10CONN SOCKET SIP 28POS TIN Aries Electronics |
3,767 | 3.63 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 28 (1 x 28) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
40-6503-20CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
4,928 | 3.64 |
|
Datasheet |
503 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
36-3551-10CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics |
3,620 | 3.65 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
36-3553-10CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics |
4,270 | 3.65 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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