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IC Sockets
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
10-0503-30CONN SOCKET SIP 10POS GOLD |
1,492 | 1.20 |
|
Datasheet |
0503 | Bulk | Active | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
|
|
20-0518-11HCONN SOCKET SIP 20POS GOLD |
1,068 | 1.20 |
|
Datasheet |
518 | Bulk | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
34-0518-11CONN SOCKET SIP 34POS GOLD |
3,865 | 1.20 |
|
Datasheet |
518 | Bulk | Active | SIP | 34 (1 x 34) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
110-83-648-41-105101CONN IC DIP SOCKET 48POS GOLD |
3,119 | 0.80 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-80-037-10-061101PGA SOLDER TAIL |
3,001 | 0.85 |
|
Datasheet |
550 | Bulk | Active | PGA | 37 (10 x 10) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
HLS-0205-G-11.100" SCREW MACHINE SOCKET ARRAY |
4,651 | - |
|
Datasheet |
HLS | Tube | Active | SIP | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
116-83-632-41-008101CONN IC DIP SOCKET 32POS GOLD |
1,251 | 0.80 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-83-072-11-001101CONN SOCKET PGA 72POS GOLD |
3,302 | 0.73 |
|
Datasheet |
510 | Bulk | Active | PGA | 72 (11 x 11) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-83-072-11-041101CONN SOCKET PGA 72POS GOLD |
3,759 | 0.73 |
|
Datasheet |
510 | Bulk | Active | PGA | 72 (11 x 11) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
C9124-00CONN IC DIP SOCKET 24POS GOLD |
3,887 | - |
|
Datasheet |
Edge-Grip™, C91 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
22-4513-11CONN IC DIP SOCKET 22POS GOLD |
3,161 | 1.21 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
299-83-318-11-001101CONN IC DIP SOCKET 18POS GOLD |
3,145 | 0.67 |
|
Datasheet |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
ICO-322-SGT.100" LOW PROFILE SCREW MACHINE |
1,242 | - |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
|
ICA-422-WTT.100" SCREW MACHINE DIP SOCKET |
3,774 | - |
|
Datasheet |
ICA | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
|
ICA-322-SGT.100" SCREW MACHINE DIP SOCKET |
2,147 | - |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
|
ICA-322-WTT.100" SCREW MACHINE DIP SOCKET |
2,414 | - |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
|
29-0518-11CONN SOCKET SIP 29POS GOLD |
4,629 | 1.07 |
|
Datasheet |
518 | Bulk | Active | SIP | 29 (1 x 29) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
614-87-652-31-012101CONN IC DIP SOCKET 52POS GOLD |
2,905 | 0.73 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
612-87-950-41-001101CONN IC DIP SOCKET 50POS GOLD |
3,638 | 0.79 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
32-6518-00CONN IC DIP SOCKET 32POS GOLD |
4,473 | 1.07 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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