HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    814-AG10D-ES

    814-AG10D-ES

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,223 -
    RFQ
    814-AG10D-ES

    Datasheet

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Copper Alloy Polyester -55°C ~ 105°C
    123-83-428-41-001101

    123-83-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    1,045 0.60
    RFQ
    123-83-428-41-001101

    Datasheet

    123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PLCC-032-T-N-TR

    PLCC-032-T-N-TR

    CONN SOCKET PLCC 32POS TIN

    Samtec Inc.

    2,556 -
    RFQ
    PLCC-032-T-N-TR

    Datasheet

    PLCC Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-87-322-41-004101

    116-87-322-41-004101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,647 0.61
    RFQ
    116-87-322-41-004101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-009101

    116-87-328-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,569 0.56
    RFQ
    116-87-328-41-009101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-632-41-105191

    110-83-632-41-105191

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,903 0.84
    RFQ

    -

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 50-HZL/07-TT

    AR 50-HZL/07-TT

    SOCKET

    Assmann WSW Components

    4,808 -
    RFQ

    -

    AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ICO-318-CTT

    ICO-318-CTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,331 -
    RFQ
    ICO-318-CTT

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    916788-1

    916788-1

    CONN SOCKET PGA ZIF 462POS TIN

    TE Connectivity AMP Connectors

    3,233 -
    RFQ
    916788-1

    Datasheet

    - Tray Obsolete PGA, ZIF (ZIP) 462 (19 x 19) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Liquid Crystal Polymer (LCP) -
    XR2A-1425

    XR2A-1425

    CONN IC DIP SOCKET 14POS GOLD

    Omron Electronics Inc-EMC Div

    3,172 0.59
    RFQ
    XR2A-1425

    Datasheet

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    C9118-00

    C9118-00

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    1,162 -
    RFQ
    C9118-00

    Datasheet

    Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-9513-10

    20-9513-10

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,293 1.09
    RFQ
    20-9513-10

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-6513-10T

    30-6513-10T

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,979 1.09
    RFQ
    30-6513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-0513-10H

    22-0513-10H

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    1,016 1.09
    RFQ
    22-0513-10H

    Datasheet

    0513 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-1518-10T

    40-1518-10T

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,146 1.09
    RFQ
    40-1518-10T

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-308-SGG-L

    ICO-308-SGG-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,680 -
    RFQ
    ICO-308-SGG-L

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-SGG-L

    ICA-308-SGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,962 -
    RFQ
    ICA-308-SGG-L

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-ZWGT-2

    ICA-308-ZWGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,771 -
    RFQ
    ICA-308-ZWGT-2

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0112-T-22

    HLS-0112-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,971 -
    RFQ
    HLS-0112-T-22

    Datasheet

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-83-424-41-009101

    116-83-424-41-009101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,542 0.61
    RFQ
    116-83-424-41-009101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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