HONG KONG HAOCHIP TRADING CO., LIMITED - IC Sockets - Sockets for ICs, Transistors | Page 2 | Genuine Components, Fast Shipping

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
A-CCS 044-Z-T CONN SOCKET PLCC 44POS TIN Assmann WSW Components	7,055	1.28	RFQ	Datasheet	-	Tube	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
D01-9972042 CONN SOCKET SIP 20POS GOLD Harwin Inc.	8,730	1.46	RFQ	Datasheet	D01-997	Tube	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-44-424-41-001000 CONN IC DIP SOCKET 24POS TIN Mill-Max Manufacturing Corp.	1,703	1.14	RFQ	Datasheet	110	Tube	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
940-44-032-17-400000 CONN SOCKET PLCC 32POS TIN Mill-Max Manufacturing Corp.	1,810	1.58	RFQ	Datasheet	940	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
10-3513-10 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	1,452	1.81	RFQ	Datasheet	Lo-PRO®file, 513	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
110-13-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	600	1.14	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
D2816-42 CONN IC DIP SOCKET 16POS GOLD Harwin Inc.	2,770	1.54	RFQ	Datasheet	D2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
214-44-314-01-670800 CONN IC DIP SOCKET 14POS TIN Mill-Max Manufacturing Corp.	9,045	1.30	RFQ	Datasheet	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
SA406000 CONN IC DIP SOCKET 40POS GOLD On Shore Technology Inc.	1,417	1.40	RFQ	Datasheet	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
8432-21B1-RK-TP CONN SOCKET PLCC 32POS TIN 3M	2,433	1.50	RFQ	Datasheet	8400	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
08-3518-00 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	947	1.31	RFQ	Datasheet	518	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
110-43-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	3,002	1.16	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-93-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	2,715	1.16	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-44-328-41-001000 CONN IC DIP SOCKET 28POS TIN Mill-Max Manufacturing Corp.	1,520	1.33	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-44-628-41-001000 CONN IC DIP SOCKET 28POS TIN Mill-Max Manufacturing Corp.	1,002	1.33	RFQ	Datasheet	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
940-44-044-17-400000 CONN SOCKET PLCC 44POS TIN Mill-Max Manufacturing Corp.	4,947	1.89	RFQ	Datasheet	940	Tube	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
8444-11B1-RK-TP CONN SOCKET PLCC 44POS TIN 3M	1,492	1.69	RFQ	Datasheet	8400	Tube	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
8444-21B1-RK-TP CONN SOCKET PLCC 44POS TIN 3M	2,201	1.71	RFQ	Datasheet	8400	Tube	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
A-CCS 068-Z-T CONN SOCKET PLCC 68POS TIN Assmann WSW Components	1,252	1.66	RFQ	Datasheet	-	Tube	Active	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
917-43-103-41-005000 CONN TRANSIST TO-5 3POS GOLD Mill-Max Manufacturing Corp.	932	1.46	RFQ	Datasheet	917	Tube	Active	Transistor, TO-5	3 (Round)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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