HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    117-87-430-41-105101

    117-87-430-41-105101

    CONN IC DIP SOCKET 30POS GOLD

    Preci-Dip

    1,340 0.38
    RFQ
    117-87-430-41-105101

    Datasheet

    117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D2864-42

    D2864-42

    CONN IC DIP SOCKET 64POS GOLD

    Harwin Inc.

    1,280 -
    RFQ
    D2864-42

    Datasheet

    D2 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
    HLS-0208-TT-22

    HLS-0208-TT-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    1,382 -
    RFQ
    HLS-0208-TT-22

    Datasheet

    HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    510-87-073-11-061101

    510-87-073-11-061101

    CONN SOCKET PGA 73POS GOLD

    Preci-Dip

    2,072 0.44
    RFQ
    510-87-073-11-061101

    Datasheet

    510 Bulk Active PGA 73 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-316-41-004101

    116-87-316-41-004101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    1,211 0.41
    RFQ
    116-87-316-41-004101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    BU200Z-178-HT

    BU200Z-178-HT

    CONN IC DIP SOCKET 20POS GOLD

    On Shore Technology Inc.

    2,841 -
    RFQ
    BU200Z-178-HT

    Datasheet

    BU-178HT Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    146-87-424-41-036101

    146-87-424-41-036101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,571 0.38
    RFQ
    146-87-424-41-036101

    Datasheet

    146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-320-STL-O-TR

    ICF-320-STL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,335 -
    RFQ
    ICF-320-STL-O-TR

    Datasheet

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-320-STL-I-TR

    ICF-320-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    1,960 -
    RFQ
    ICF-320-STL-I-TR

    Datasheet

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    122-87-324-41-001101

    122-87-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    1,796 0.36
    RFQ
    122-87-324-41-001101

    Datasheet

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-624-41-035101

    146-87-624-41-035101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,102 0.39
    RFQ
    146-87-624-41-035101

    Datasheet

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-624-41-036101

    146-87-624-41-036101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,120 0.39
    RFQ
    146-87-624-41-036101

    Datasheet

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-044-08-031101

    510-83-044-08-031101

    CONN SOCKET PGA 44POS GOLD

    Preci-Dip

    1,296 0.38
    RFQ
    510-83-044-08-031101

    Datasheet

    510 Bulk Active PGA 44 (8 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-632-31-012101

    614-87-632-31-012101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    1,118 0.41
    RFQ
    614-87-632-31-012101

    Datasheet

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-4513-11H

    08-4513-11H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,705 0.73
    RFQ
    08-4513-11H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-6513-10T

    20-6513-10T

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,171 0.72
    RFQ
    20-6513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-0518-11

    21-0518-11

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    4,742 0.72
    RFQ
    21-0518-11

    Datasheet

    518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-422-STT

    ICA-422-STT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,195 -
    RFQ
    ICA-422-STT

    Datasheet

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-422-STT

    ICO-422-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,752 -
    RFQ
    ICO-422-STT

    Datasheet

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-322-STT

    ICO-322-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    1,173 -
    RFQ
    ICO-322-STT

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
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