HONG KONG HAOCHIP TRADING CO., LIMITED

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-87-636-41-105101

    110-87-636-41-105101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    1,842 0.42
    RFQ
    110-87-636-41-105101

    Datasheet

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-210-41-004101

    116-83-210-41-004101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,504 0.39
    RFQ
    116-83-210-41-004101

    Datasheet

    116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-610-41-013101

    116-87-610-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    1,994 0.41
    RFQ
    116-87-610-41-013101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-87-648-41-005101

    117-87-648-41-005101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    1,459 0.39
    RFQ
    117-87-648-41-005101

    Datasheet

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1437542-0

    1-1437542-0

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    4,314 -
    RFQ
    1-1437542-0

    Datasheet

    700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
    110-87-314-41-105191

    110-87-314-41-105191

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,194 0.19
    RFQ

    -

    110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0104-G-32

    HLS-0104-G-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,027 -
    RFQ
    HLS-0104-G-32

    Datasheet

    HLS Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    614-87-636-41-001101

    614-87-636-41-001101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    1,552 0.42
    RFQ
    614-87-636-41-001101

    Datasheet

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-320-41-001101

    116-87-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    1,680 0.37
    RFQ
    116-87-320-41-001101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    528-AG11D-ES

    528-AG11D-ES

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    2,746 -
    RFQ
    528-AG11D-ES

    Datasheet

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    116-87-318-41-011101

    116-87-318-41-011101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,691 0.37
    RFQ
    116-87-318-41-011101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-WTT-3

    ICA-308-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    1,216 -
    RFQ
    ICA-308-WTT-3

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-624-41-006101

    116-83-624-41-006101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,009 0.38
    RFQ
    116-83-624-41-006101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    500-032-050

    500-032-050

    CONN SOCKET SIP 32POS GOLD

    3M

    1,395 -
    RFQ
    500-032-050

    Datasheet

    - Box Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    110-83-632-41-005101

    110-83-632-41-005101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,951 0.38
    RFQ
    110-83-632-41-005101

    Datasheet

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-632-41-605101

    110-83-632-41-605101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,570 0.38
    RFQ
    110-83-632-41-605101

    Datasheet

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-88-084-24-008

    540-88-084-24-008

    CONN SOCKET PLCC 84POS TIN

    Preci-Dip

    3,998 0.39
    RFQ
    540-88-084-24-008

    Datasheet

    540 Bulk Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    21-0513-10

    21-0513-10

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,281 0.70
    RFQ
    21-0513-10

    Datasheet

    0513 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0513-11H

    11-0513-11H

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    3,412 0.71
    RFQ
    11-0513-11H

    Datasheet

    0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0513-10T

    23-0513-10T

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    2,216 0.70
    RFQ
    23-0513-10T

    Datasheet

    0513 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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