HONG KONG HAOCHIP TRADING CO., LIMITED

    RFI and EMI - Contacts, Fingerstock and Gaskets

    制造商 Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
    4186PA51H00100

    4186PA51H00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    3,792 0.04
    RFQ
    4186PA51H00100

    Datasheet

    51H Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 1.000" (25.40mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
    10117780-001LF

    10117780-001LF

    RFI FINGERSTOCK CU GOLD SOLDER

    Amphenol ICC (FCI)

    2,507 -
    RFQ
    10117780-001LF

    Datasheet

    - Tape & Reel (TR) Active Fingerstock - 0.236" (6.00mm) 0.268" (6.80mm) 0.083" (2.10mm) Copper Alloy Gold 30.0µin (0.76µm) Solder -
    4052AC51H00071

    4052AC51H00071

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    4,159 -
    RFQ
    4052AC51H00071

    Datasheet

    51H Bulk Active Fabric Over Foam D-Shape 0.079" (2.00mm) 0.710" (18.03mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
    10121135-001LF

    10121135-001LF

    RFI FINGERSTOCK CU GOLD SOLDER

    Amphenol ICC (FCI)

    4,276 -
    RFQ
    10121135-001LF

    Datasheet

    - Tube Obsolete Fingerstock - 0.315" (8.00mm) 0.470" (11.95mm) 0.138" (3.50mm) Copper Alloy Gold 30.0µin (0.76µm) Solder -
    4520PA51G00100

    4520PA51G00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    3,903 0.05
    RFQ

    -

    51G Bulk Active Fabric Over Foam Square 0.080" (2.03mm) 1.000" (25.40mm) 0.080" (2.03mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
    120220-0313

    120220-0313

    RFI SHD FINGER TITAN CU NICK SLD

    ITT Cannon, LLC

    1,689 -
    RFQ
    120220-0313

    Datasheet

    - Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.038" (0.96mm) 0.147" (3.73mm) 0.118" (3.00mm) Titanium Copper Nickel 118.11µin (3.00µm) Solder -
    67SLA060080070PI00

    67SLA060080070PI00

    SLA W6XH8XL7MM

    Laird Technologies EMI

    3,734 -
    RFQ

    -

    SMD Contact Bulk Obsolete - - - - - - - - - -
    120220-0315

    120220-0315

    RFI SHD FINGER TITAN CU NICK SLD

    ITT Cannon, LLC

    4,605 -
    RFQ
    120220-0315

    Datasheet

    - Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.038" (0.96mm) 0.157" (3.99mm) 0.157" (4.00mm) Titanium Copper Nickel 118.11µin (3.00µm) Solder -
    1-1447360-1

    1-1447360-1

    RFI SHLD FINGER CU GOLD SOLDER

    TE Connectivity AMP Connectors

    2,823 0.03
    RFQ
    1-1447360-1

    Datasheet

    - Tape & Reel (TR) Active Shield Finger, Pre-Loaded - 0.039" (1.00mm) 0.138" (3.50mm) 0.055" (1.40mm) Copper Alloy Gold 1.967µin (0.05µm) Solder -
    1554825-1

    1554825-1

    RFI SHLD FINGER CU GOLD SOLDER

    TE Connectivity AMP Connectors

    3,301 0.06
    RFQ
    1554825-1

    Datasheet

    - Bag Active Shield Finger, Pre-Loaded - 0.045" (1.15mm) 0.094" (2.40mm) 0.051" (1.30mm) Copper Alloy Gold Flash Solder -
    BMI-C-001-SN

    BMI-C-001-SN

    RFI SHLD FINGER BECU TIN SOLDER

    Laird Technologies EMI

    3,034 0.06
    RFQ
    BMI-C-001-SN

    Datasheet

    BMI-C Tape & Reel (TR) Active Shield Finger - 0.079" (2.00mm) 0.122" (3.11mm) 0.096" (2.44mm) Beryllium Copper Tin - Solder -
    10103958-001LF

    10103958-001LF

    RFI FINGERSTOCK CU TIN

    Amphenol ICC (FCI)

    4,270 -
    RFQ
    10103958-001LF

    Datasheet

    - Tape & Reel (TR) Active Fingerstock - 0.315" (8.00mm) 0.470" (11.95mm) 0.132" (3.35mm) Copper Alloy Tin 30.0µin (0.76µm) - -
    4912PA51H00100

    4912PA51H00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    3,248 0.07
    RFQ

    -

    51H Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 1.000" (25.40mm) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
    67BCG2504303510R00

    67BCG2504303510R00

    RFI FINGERSTOCK BECU GOLD SOLDER

    Laird Technologies EMI

    2,429 0.08
    RFQ
    67BCG2504303510R00

    Datasheet

    BCG Bulk Active Fingerstock - 0.098" (2.50mm) 0.169" (4.30mm) 0.138" (3.50mm) Beryllium Copper Gold - Solder -
    4157PA51H00100

    4157PA51H00100

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    1,404 0.08
    RFQ

    -

    ECOGREEN™ Bulk Active Fabric Over Foam Rectangle 0.787" (20.00mm) 1.000" (25.40mm) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
    SMG118157R-0.197

    SMG118157R-0.197

    RFI FILM OVER FOAM PU

    Leader Tech Inc.

    2,734 -
    RFQ
    SMG118157R-0.197

    Datasheet

    - Tape & Reel (TR) Obsolete Film Over Foam Rectangle 0.157" (4.00mm) 0.197" (5.00mm) 0.118" (3.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - - -
    SMG256197R-0.118

    SMG256197R-0.118

    RFI FILM OVER FOAM PU

    Leader Tech Inc.

    4,456 -
    RFQ
    SMG256197R-0.118

    Datasheet

    - Tape & Reel (TR) Obsolete Film Over Foam Rectangle 0.197" (5.00mm) 0.256" (6.50mm) 0.118" (3.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - - -
    67BCG2003201508R00

    67BCG2003201508R00

    RFI FINGERSTOCK BECU GOLD SOLDER

    Laird Technologies EMI

    1,079 0.09
    RFQ
    67BCG2003201508R00

    Datasheet

    BCG Bulk Active Fingerstock - 0.078" (2.00mm) 0.126" (3.20mm) 0.059" (1.50mm) Beryllium Copper Gold - Solder -
    10116189-001LF

    10116189-001LF

    RFI FINGERSTOCK CU GOLD

    Amphenol ICC (FCI)

    3,029 -
    RFQ
    10116189-001LF

    Datasheet

    - Tape & Reel (TR) Active Fingerstock - - - - Copper Alloy Gold 3.00µin (0.076µm) - -
    67B5N4004005108R00

    67B5N4004005108R00

    SP,CON,TNR 5.10X4.00X4.00MM

    Laird Technologies EMI

    2,909 -
    RFQ

    -

    - Cut Tape (CT) Active - - - - - - - - - -
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