HONG KONG HAOCHIP TRADING CO., LIMITED

    RFI and EMI - Contacts, Fingerstock and Gaskets

    制造商 Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Shape Width Length Height Material Plating Plating - Thickness Attachment Method Operating Temperature
    67SLH050050050PI00

    67SLH050050050PI00

    RFI FILM OVER FOAM PU SOLDER

    Laird Technologies EMI

    14,639 0.18
    RFQ
    67SLH050050050PI00

    Datasheet

    SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Hourglass 0.197" (5.00mm) 0.197" (5.00mm) 0.197" (5.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
    67SLG050060050PI00

    67SLG050060050PI00

    RFI FILM OVER FOAM PU SOLDER

    Laird Technologies EMI

    753 -
    RFQ
    67SLG050060050PI00

    Datasheet

    SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Rectangle 0.197" (5.00mm) 0.197" (5.00mm) 0.236" (6.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
    67SLH060100050PI00

    67SLH060100050PI00

    RFI FILM OVER FOAM PU SOLDER

    Laird Technologies EMI

    7,783 0.59
    RFQ
    67SLH060100050PI00

    Datasheet

    SMD Grounding Metallized Tape & Reel (TR) Active Film Over Foam Hourglass 0.236" (6.00mm) 0.197" (5.00mm) 0.394" (10.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder -40°C ~ 70°C
    67B6G2007503015R00

    67B6G2007503015R00

    RFI FINGERSTOCK BECU GOLD SOLDER

    Laird Technologies EMI

    886 0.47
    RFQ
    67B6G2007503015R00

    Datasheet

    B6G Tape & Reel (TR) Active Fingerstock - 0.079" (2.00mm) 0.295" (7.50mm) 0.118" (3.00mm) Beryllium Copper Gold - Solder -
    BMI-C-004

    BMI-C-004

    RFI FINGERSTOCK BECU GOLD SOLDER

    Laird Technologies EMI

    5,411 1.26
    RFQ
    BMI-C-004

    Datasheet

    BMI-C Tape & Reel (TR) Active Fingerstock - 0.170" (4.32mm) 0.235" (5.97mm) 0.204" (5.17mm) Beryllium Copper Gold - Solder -
    67B3G2504810010R00

    67B3G2504810010R00

    RFI FINGERSTOCK BECU GOLD SOLDER

    Laird Technologies EMI

    2,085 1.22
    RFQ
    67B3G2504810010R00

    Datasheet

    B3G Tape & Reel (TR) Active Fingerstock - 0.098" (2.50mm) 0.189" (4.80mm) 0.394" (10.00mm) Beryllium Copper Gold - Solder -
    0097072802

    0097072802

    GASKET BECU 15.88X11.35MM

    Laird Technologies EMI

    1,840 2.48
    RFQ
    0097072802

    Datasheet

    USB Connector Bulk Active - - 0.625" (15.88mm) 0.447" (11.35mm) - - - - - -
    4223PA51H01800

    4223PA51H01800

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    448 4.23
    RFQ
    4223PA51H01800

    Datasheet

    51H Bulk Active Fabric Over Foam Rectangle 0.157" (4.00mm) 18.000" (457.20mm) 0.039" (1.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
    4688PA51H01800

    4688PA51H01800

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    1,255 4.48
    RFQ
    4688PA51H01800

    Datasheet

    51H Bulk Active Fabric Over Foam Rectangle 0.118" (3.00mm) 18.000" (457.20mm) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
    4220PA51H01800

    4220PA51H01800

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    979 4.48
    RFQ
    4220PA51H01800

    Datasheet

    51H Bulk Active Fabric Over Foam Rectangle 0.201" (5.10mm) 18.000" (457.20mm) 0.039" (1.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
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