HONG KONG HAOCHIP TRADING CO., LIMITED

    Microcontrollers, Microprocessor, FPGA Modules

    制造商 Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature





































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
    AM0010-02-3BI21MA

    AM0010-02-3BI21MA

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    4,005 -
    RFQ

    -

    Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU3EG-1I - - 128MB 4GB Board-to-Board (BTB) Socket 2.205" L x 1.575" W (56.00mm x 40.00mm) -40°C ~ 85°C
    AM0010-02-4DE21MA

    AM0010-02-4DE21MA

    MPSOC MODULE WITH XILINX ZYNQ UL

    Trenz Electronic GmbH

    1,797 -
    RFQ

    -

    Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU4EV - - 128MB 4GB Board-to-Board (BTB) Socket 2.220" L x 1.575" W (56.40mm x 40.00mm) 0°C ~ 85°C
    TE0803-01-04CG-1EA

    TE0803-01-04CG-1EA

    IC MODULE ZYNQ USCALE 2GB 128MB

    Trenz Electronic GmbH

    3,099 135.00
    RFQ
    TE0803-01-04CG-1EA

    Datasheet

    TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4CG-1SFVC784E - - 128MB 2GB B2B 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
    TE0803-02-04CG-1EB

    TE0803-02-04CG-1EB

    IC MODULE ZYNQ USCALE 2GB 256MB

    Trenz Electronic GmbH

    2,006 138.00
    RFQ
    TE0803-02-04CG-1EB

    Datasheet

    TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4CG-1SFVC784E - - 256MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
    TE0823-01-3PIU1ML

    TE0823-01-3PIU1ML

    ICOBOARD

    Trenz Electronic GmbH

    3,517 -
    RFQ
    TE0823-01-3PIU1ML

    Datasheet

    TE0823 Bulk Active MCU, FPGA ARM Cortex-A53, ARM® Cortex®-R5 Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I - 128MB 1GB USB 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
    TE0823-01-3PIU1MA

    TE0823-01-3PIU1MA

    ICOBOARD

    Trenz Electronic GmbH

    2,567 -
    RFQ
    TE0823-01-3PIU1MA

    Datasheet

    TE0823 Bulk Active MCU, FPGA ARM Cortex-A53, ARM® Cortex®-R5 Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I - 128MB 1GB USB 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
    TE0741-05-B2C-1-A

    TE0741-05-B2C-1-A

    MODULE FPGA KINTEX

    Trenz Electronic GmbH

    1,284 -
    RFQ

    -

    Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K160T-2FBG676C - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
    TE0745-02-72I31-A

    TE0745-02-72I31-A

    MOD SOM DDR3L 1GB

    Trenz Electronic GmbH

    1,721 161.10
    RFQ
    TE0745-02-72I31-A

    Datasheet

    TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7030) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
    TE0715-05-73E33-A

    TE0715-05-73E33-A

    SOC MODULE WITH XILINX ZYNQ 7030

    Trenz Electronic GmbH

    3,751 -
    RFQ

    -

    TE0711 Bulk Active MPU Core Zynq™ XC7Z030-3SBG485E ARM Cortex-A9 - 32MB 1GB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 85°C
    TE0745-03-72I31-A

    TE0745-03-72I31-A

    SOM WITH AMD ZYNQ 7030-2I, 1 GBY

    Trenz Electronic GmbH

    4,595 -
    RFQ

    -

    Zynq Bulk Active MPU Core ARM Cortex-A9 Xilinx Zynq 7030 SoC XC7Z030-2FBG676I - 64MB 1GB Samtec ST5 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
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